Creep Deformation and Microstructure of Alloy 617 Foil at High Temperature
The present paper reports the results of microcreep tests and microstructure of alloy 617 foils of 100μm thick specimens at 800 and 900 oC in air. Before each test, the specimens were annealed in vacuum at 950 oC for 17 hrs. The dynamic recrystallizations were observed during creep test. The voids and cracks were observed along grain boundaries. The maximum elongation of grains was found at the lowest applied stress along the loading direction. The average grain size decreases from 20 μm to 2 μm as applied stress increases from 48 to 120 MPa at 800 oC and from 50 μm to 5 μm as the applied stress increases from 35 to 60MPa at 900 oC. The steady state creep rates were increased as applied stress increased in all the specimens.
Young Won Chang, Nack J. Kim and Chong Soo Lee
S.K. Sharma et al., "Creep Deformation and Microstructure of Alloy 617 Foil at High Temperature", Advanced Materials Research, Vols. 26-28, pp. 233-236, 2007