Oxidation and Corrosion Resistance of Nanocrystalline Copper Deposit Produced by Pulse Electrodeposition


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Pulse electrodeposition was used to produce nanocrystalline (nc) copper from copper sulfate electrolyte with saccharin as additive. The grain size of nanocrystalline coatings was determined using x-ray diffraction and atomic force microscopy (AFM) which was about 30 nm. Microcrystalline copper deposits were also produced by direct current electrodeposition processes and compared with pulse plated ones. Corrosion behavior of the coatings was investigated using polarization and Impedance measurements in different solutions. The oxidation test was carried out at 650°C in an electrical furnace. It was demonstrated that the nanocrystalline film was markedly superior to regularly grained films made by direct current (DC) plating; nanocrystalline deposits show higher corrosion resistance and much higher oxidation resistance.



Advanced Materials Research (Volumes 264-265)

Edited by:

M.S.J. Hashmi, S. Mridha and S. Naher




M. Saremi and M. Abouie, "Oxidation and Corrosion Resistance of Nanocrystalline Copper Deposit Produced by Pulse Electrodeposition", Advanced Materials Research, Vols. 264-265, pp. 1519-1525, 2011

Online since:

June 2011





[1] X.Y. Wang, D.Y. Li, Mechanical and electrochemical behavior of nanocrystalline surface of 304 stainless steel, Electrochimica Acta, 47 (2002), PP. 3939-3947.

DOI: https://doi.org/10.1016/s0013-4686(02)00365-1

[2] A. Ibanez, E. Fatas, Mechanical and structural properties of electrodeposited copper and their relation with the electrodeposition parameters, Surface & Coatings Technology 191, (2005), PP. 7– 16.

DOI: https://doi.org/10.1016/j.surfcoat.2004.05.001

[3] W. Gao, H. Gong, J. He, A. Thomas, L. Chan, S. Li, Oxidation behaviour of Cu thin films on Si wafer at 175–400ºC, Materials Letters 51(2001), PP. 78–84.

DOI: https://doi.org/10.1016/s0167-577x(01)00268-3

[4] J. Li, G. Vizekelethy, P. Revez, J.W. Mayer, K.N. Tu, Oxidation behaviour of Cu thin films on Si wafer at 175–400°C, J. Appl. Phys. 69(1991), P. 1020.

[5] ‏ Vinogradov A, Mimaki T, Hashimoto S, Valiev RZ. On the corrosion behavior of ultra-grained copper, Scripta Materilia. 411, 319 (1999).

[6] Rofagha R, Langer R, El-Sherik AM, Erb U, Palumbo G, Aust KT, The corrosion behavior of nanocrystalline nickel, Scripta Metall 25, 2867 (1991).

DOI: https://doi.org/10.1016/0956-716x(91)90171-v

[7] Hiroyuki Miyamoto, Kohei Harada, Takuro Mimaki, Alexei Vinogradov, Satoshi Hashimoto, "Corrosion of ultrafine grained copper fabricated by equal channel angular pressing, Corrosion Science 50, 1215(2008).

DOI: https://doi.org/10.1016/j.corsci.2008.01.024

[8] S. Tao, D.Y. Li, Investigation of corrosion–wear synergistic attack on nanocrystalline Cu deposits, Wear 263, 363 (2007).

DOI: https://doi.org/10.1016/j.wear.2007.01.056

[9] Hai-Bo Lu , Ying Li, Fu-Hui Wang, Thin Solid Films 510, 197 (2006). Synthesis of porous copper from nanocrystalline two-phase Cu–Zr film by dealloying.

DOI: https://doi.org/10.1016/j.scriptamat.2006.09.009

[10] M. Stangl, V. Dittel, J. Acker, V. Hoffmann, W. Gruner, S. Strehle, K. Wetzig, Investigation of organic impurities adsorbed on and incorporated into electroplated copper layers, Applied Surface Science 252 (2005), PP. 158–161.

DOI: https://doi.org/10.1016/j.apsusc.2005.02.006

[11] S. Tao, D. Y. Li, Tribological, mechanical and electrochemical properties of nanocrystalline copper deposits produced by pulse electrodeposition, Nanotechnology 17(2006), PP. 65–78.

DOI: https://doi.org/10.1088/0957-4484/17/1/012

[12] S. Glasstone, Electrode potentials and the form of electrodeposited metals, ‏ Trans. Faraday Soc. 31 (1935) PP. 1232–7‏.

DOI: https://doi.org/10.1039/tf9353101232

[13] B. D. Cullity, S. R. Stock, Elements of X-ray Diffraction, (Englewood Cliffs, NJ: Prentice-Hall) (2001) P. 170. ‏.

[14] R. A. Varin, J. Bystrzycki, A. Calka, Effect of annealing on the microstructure, ordering and microhardness of ball milled cubic (L12) titanium trialuminide intermetallic powder, ‏ Intermetallics 7 (1999) PP. 785–96. ‏.

DOI: https://doi.org/10.1016/s0966-9795(98)00127-7

[15] V. Maurice, H. H. Strehbolw, P. Marcus, In Situ Scanning tunneling microscope study of the passivation of Cu (111), J. Electrochem. Soc. 146 (1999) PP. 524–30. ‏.

DOI: https://doi.org/10.1149/1.1391638

[16] Y. Zhu, K. Mimura, J. Lim, M. Isshiki, Q. Jiang, Brief review of oxidation kinetics of copper at 350 °C to 1050 °C, Metallurgical and Materials Transactions A, Vol. 37A, (2006), PP. 1231- 1237.

DOI: https://doi.org/10.1007/s11661-006-1074-y

[17] M. Saremi M. Abouie, R Vaghar, Electrochemical and physical properties of Nanocrystaline copper deposits produced by pulse electrodeposition, International Journal of Modern Physics B, Vol. 22, Issue 18-19, (2008).

DOI: https://doi.org/10.1142/s0217979208047869