Application of Finite Element Method in Optimal Design of Flip-Chip Package

Abstract:

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More and more solder joints in circuit boards and electronic products are changing to lead free solder, placing an emphasis on lead free solder joint reliability. Solder joint fatigue failure is a serious reliability concern in area array technologies. In this study, the effects of substrate materials on the solder joint thermal fatigue life were investigated by finite element model. Accelerated temperature cycling loading was imposed to evaluate the reliability of solder joints. The thermal strain/stress in solder joints of flip chip assemblies with different substrates was compared, and the fatigue life of solder joints were evaluated by Darveaux’s crack initiation and growth model. The results show the mechanisms of substrate flexibility on improving solder joint thermal fatigue.

Info:

Periodical:

Advanced Materials Research (Volumes 264-265)

Edited by:

M.S.J. Hashmi, S. Mridha and S. Naher

Pages:

1660-1665

DOI:

10.4028/www.scientific.net/AMR.264-265.1660

Citation:

Y. C. Lin and Y. C. Xia, "Application of Finite Element Method in Optimal Design of Flip-Chip Package", Advanced Materials Research, Vols. 264-265, pp. 1660-1665, 2011

Online since:

June 2011

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Price:

$35.00

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