Microstructure and Characteristics of Interfacial Region in Soldering Joint of ZA Alloy

Abstract:

Article Preview

Analytical instruments such as optical microscope, SEM and TEM are employed to investigate and analyze the microstructure and characteristics of soldering joint interfacial region. The results indicated that interactive crystallization exists in part of the interfacial region by using a newly developed kind of soldering filler metal. The composition of the interfacial region is complex such that both solid solution of Cd,Sn,Zn and small amounts of fine grained compounds of Mg2Sn,MgZn exist. Solid solution can improve the strength and plasticity, and small amounts of fine-grained compounds can strengthen the matrix which is beneficial for improving the bonding strength. However, successive laminate structure of intermetallic compounds will result in embitterment and deteriorate the properties of the joint.

Info:

Periodical:

Advanced Materials Research (Volumes 268-270)

Edited by:

Feng Xiong

Pages:

418-421

DOI:

10.4028/www.scientific.net/AMR.268-270.418

Citation:

X. Z. Liu et al., "Microstructure and Characteristics of Interfacial Region in Soldering Joint of ZA Alloy", Advanced Materials Research, Vols. 268-270, pp. 418-421, 2011

Online since:

July 2011

Export:

Price:

$35.00

In order to see related information, you need to Login.

In order to see related information, you need to Login.