High Temperature Resistance of Epoxy Adhesives under the Room-Temperature Curing

Abstract:

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High-temperature resistant epoxy adhesives cured under room-temperature becomes more and more important in many industries such as aerospace and aviation, the locomotive and diesel, etc. In this paper three self-made amine-based mannich-amide was mixed with E-44 epoxy resin under the same technological parameters, and the epoxy adhesives cured by the three amine-based mannich-amides under room-temperature are tested by FTIR, TGA and DMA. Results of TGA show a quicker drop in weight occurrence within 150-250°C for epoxy networks cured by multiamine-based mannich amides than the long-chain alkyl one. Results of FTIR show completely curing of epoxy adhesives cured by mannich amides under room temperature and the height of absorption band 1502cm-1 (C-N) is much lower after 12h under 150°C,200°C atmosphere than 25°C. Results of DMA show that the Tg determined by DMA has an order EP AN2(89.9°C) >EP AN1(89.7°C)>EP AN3(80.8°C). In the rest results of DMA, the EP-AN3 system has the biggest storage modulus (E’) within 100-150°C while the EP-AN3 system has the smallest loss modulus(E”) within 100-150°C. As a whole, the epoxy adhesives cured by AN3 under room-temperature have the best high temperature resistance.

Info:

Periodical:

Advanced Materials Research (Volumes 284-286)

Main Theme:

Edited by:

Xiaoming Sang, Pengcheng Wang, Liqun Ai, Yungang Li and Jinglong Bu

Pages:

1804-1807

DOI:

10.4028/www.scientific.net/AMR.284-286.1804

Citation:

D. L. Ran et al., "High Temperature Resistance of Epoxy Adhesives under the Room-Temperature Curing", Advanced Materials Research, Vols. 284-286, pp. 1804-1807, 2011

Online since:

July 2011

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Price:

$35.00

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