High Temperature Resistance of Epoxy Adhesives under the Room-Temperature Curing
High-temperature resistant epoxy adhesives cured under room-temperature becomes more and more important in many industries such as aerospace and aviation, the locomotive and diesel, etc. In this paper three self-made amine-based mannich-amide was mixed with E-44 epoxy resin under the same technological parameters, and the epoxy adhesives cured by the three amine-based mannich-amides under room-temperature are tested by FTIR, TGA and DMA. Results of TGA show a quicker drop in weight occurrence within 150-250°C for epoxy networks cured by multiamine-based mannich amides than the long-chain alkyl one. Results of FTIR show completely curing of epoxy adhesives cured by mannich amides under room temperature and the height of absorption band 1502cm-1 (C-N) is much lower after 12h under 150°C,200°C atmosphere than 25°C. Results of DMA show that the Tg determined by DMA has an order EP AN2(89.9°C) >EP AN1(89.7°C)>EP AN3(80.8°C). In the rest results of DMA, the EP-AN3 system has the biggest storage modulus (E’) within 100-150°C while the EP-AN3 system has the smallest loss modulus(E”) within 100-150°C. As a whole, the epoxy adhesives cured by AN3 under room-temperature have the best high temperature resistance.
Xiaoming Sang, Pengcheng Wang, Liqun Ai, Yungang Li and Jinglong Bu
D. L. Ran et al., "High Temperature Resistance of Epoxy Adhesives under the Room-Temperature Curing", Advanced Materials Research, Vols. 284-286, pp. 1804-1807, 2011