High Temperature Creep Behavior of Zn-1.0Cu-0.2Ti Alloy


Article Preview

In the present work, Zn-1.0Cu-0.2Ti alloy was prepared by melt casting and extruding processes. High temperature creep property of the alloy was determined using electronic creep relaxation testing machine. Microstructures of the alloy before and after creep test were observed and its high temperature creep mechanism was discussed. The results show that the steady-state creep rate of the alloy increases with temperature and stress. The logarithm of steady-state creep rate (ln) shows a linearity relationship with the logarithm of the stress (lnσ) and reciprocal of temperature (1/T). The stress exponent and apparent activation energy for creep have been determined to be 5.10 and 83.7 kJ/mol, separately. The predominant mechanism is mainly self-diffusional creep. The second phases on the grain boundary can block the slip of grain boundary and dislocation motion which can improve creep resistance of the alloy.



Advanced Materials Research (Volumes 287-290)

Edited by:

Jinglong Bu, Pengcheng Wang, Liqun Ai, Xiaoming Sang, Yungang Li






L. R. Xiao et al., "High Temperature Creep Behavior of Zn-1.0Cu-0.2Ti Alloy", Advanced Materials Research, Vols. 287-290, pp. 769-776, 2011

Online since:

July 2011




In order to see related information, you need to Login.

In order to see related information, you need to Login.