Materials and Fabrication Issues of Micro V-Groove for Optoelectronics Packaging


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Micro V-groove is an important optical component in the packaging of optoelectronic devices, which holds the position of the optical fibers. The micro V-groove can be fabricated by three main techniques on different materials: wet etching, ultra precision machining and molding press. The main parameters, which determine the micro V-groove quality, include core pitch, surface roughness and cured adhesive height. In this paper, three fabrication techniques are discussed to address the future needs of the next-generation optical fiber communication technology. The advantages and disadvantages of each fabrication technique are discussed with the quality issues. The findings can be served as guides for the materials and fabrication in micro V-groove in optoelectronic packaging.



Advanced Materials Research (Volumes 295-297)

Edited by:

Pengcheng Wang, Liqun Ai, Yungang Li, Xiaoming Sang and Jinglong Bu




Y. Zheng and J. Duan, "Materials and Fabrication Issues of Micro V-Groove for Optoelectronics Packaging", Advanced Materials Research, Vols. 295-297, pp. 1330-1334, 2011

Online since:

July 2011





[1] K. Kato and Y. Tohmori: J. Sel. Top. Quant. Electron. Vol. 6 (2000), p.4.

[2] G.L. Bona: Microsyst. Technol. Vol. 9 (2003), p.291.

[3] R.E. Warburton, F. Lzdebski, C. Reimer, J. Leach, D.G. Ireland, M. Padgett and G.S. Buller: optics Express, Vol. 19 (2011), p.2670.

[4] S. To, C.F. Cheung, S.J. Wang and W.B. Lee: Key Eng. Mater. Vol. 339 (2007), p.286.

[5] M.A. Uddin, M.Y. Ali and H.P. Chan: Rev. Adv. Mater. Sci. Vol. 21 (2009), p.155.

[6] D.B. Lee: J. Appl. Phys. Vol. 40 (1969), p.4569.

[7] M. Shikida, N. Inagaki, H. Sasaki, H. Amakawa, K. Fukuzawa and K. Sato: J. Miromech. Microeng. Vol. 20 (2010), p.015038.

[8] N.P. Blake: J. Am. Chem. Soc. Vol. 73 (1990), p.949.

[9] T.G. Bifano, T.A. Dow and R.O. Scattergood: J. Appl. Mech-T ASME Vol. 113 (1991), p.184.

[10] S. Shimada, N. Ikawa, T. Inamura, N. Takezawa, H. Omori and T Sata: Annals of CIRP Vol. 44 (1995), p.523.

[11] J. Yan, T.F. Zhou J. Masuda and S. Kuriyagawa: Precision Engineering Vol. 33 (2009), p.150.

[12] M. Yasui, M. Takahashi, S. Kaneko, T. Tsuchida, Y. Hirabayashi, K. Sugimoto, J. Uegaki and R. Maeda: Jpn. J. Appl. Phys. Vol. 46 (2007), p.6378.