Design and Simulation of Molded Interconnect Devices with Two Shot Molding

Abstract:

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Three Dimensional Molded Interconnect Devices (3D-MID) has enormous potential for rationalization in both manufacturing process and the freedom to design of mechatronic products. Two shot molding is one of the most important and commonly used methods among the various MID manufacturing processes. Currently, there is a lack of effective design and simulation tools that can be used for MID with two shot molding. In this paper, an integrated product model using feature technology, some MID-specific design functions, and one special interface based on the API of Moldflow Plastics Insight (MPI) and the COM-Technology are presented. These developed product model, functions and interface increase the efficiency of the MID design process, and the design and simulation integrated environment also towards the rational and optimal design of MID products with two shot molding.

Info:

Periodical:

Advanced Materials Research (Volumes 295-297)

Edited by:

Pengcheng Wang, Liqun Ai, Yungang Li, Xiaoming Sang and Jinglong Bu

Pages:

1651-1655

DOI:

10.4028/www.scientific.net/AMR.295-297.1651

Citation:

Y. Zhuo et al., "Design and Simulation of Molded Interconnect Devices with Two Shot Molding", Advanced Materials Research, Vols. 295-297, pp. 1651-1655, 2011

Online since:

July 2011

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Price:

$35.00

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