Study on Bonding Wire Breakage Detection Using Diffraction of Light

Abstract:

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In manufacturing industry, bonding wires are used to interconnect the pads of a semiconductor chip to terminals of a package containing the chip. With increasing demand of tiny wires, current detection apparatus encounters some limitations. In this paper, a method to detect breakage of tiny bonding wires using diffraction of light is proposed. A laser head generates the light beam, and a slit is introduced in the path of light source, so the slot generates diffraction pattern, and light irradiance loss at the receiver due to the presence of a wire could be observed. Simulation results show that the proposed method with a slit design renders satisfactory detection sensitivity for tiny wires.

Info:

Periodical:

Advanced Materials Research (Volumes 301-303)

Edited by:

Riza Esa and Yanwen Wu

Pages:

553-558

DOI:

10.4028/www.scientific.net/AMR.301-303.553

Citation:

X. Y. Wang et al., "Study on Bonding Wire Breakage Detection Using Diffraction of Light", Advanced Materials Research, Vols. 301-303, pp. 553-558, 2011

Online since:

July 2011

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Price:

$35.00

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