Study on Bonding Wire Breakage Detection Using Diffraction of Light
In manufacturing industry, bonding wires are used to interconnect the pads of a semiconductor chip to terminals of a package containing the chip. With increasing demand of tiny wires, current detection apparatus encounters some limitations. In this paper, a method to detect breakage of tiny bonding wires using diffraction of light is proposed. A laser head generates the light beam, and a slit is introduced in the path of light source, so the slot generates diffraction pattern, and light irradiance loss at the receiver due to the presence of a wire could be observed. Simulation results show that the proposed method with a slit design renders satisfactory detection sensitivity for tiny wires.
Riza Esa and Yanwen Wu
X. Y. Wang et al., "Study on Bonding Wire Breakage Detection Using Diffraction of Light", Advanced Materials Research, Vols. 301-303, pp. 553-558, 2011