Fabrication of Condenser Microphones on Silicon on Insulator Wafer

Abstract:

Article Preview

A silicon condenser microphone on an SOI (silicon on insulator) substrate using only one photo mask was fabricated. This microphone consists of a diaphragm with the thickness of 20 μm and the diameter of 2 mm, a SiO2 insulative spacer (4-μm-thick buried oxide), and a 450-μm-thick silicon back plate with the meshed structures having extremely small (60 μm) hexagonal shaped acoustic holes. The gap between the 20-μm-thick silicon diaphragm and the back plate is 4 μm, which is determined by the thickness of the buried oxide in the SOI wafer. This microphone was confirmed to function as a static pressure sensor. The SOI microphone was also connected to an amplifier circuit, and exposed to the sound pressure of 110 dB at the frequency of 1 kHz. The microphone clearly responded to the input sound, and the output ac voltage of approximately 40 V was detected.

Info:

Periodical:

Advanced Materials Research (Volumes 306-307)

Edited by:

Shiquan Liu and Min Zuo

Pages:

193-200

DOI:

10.4028/www.scientific.net/AMR.306-307.193

Citation:

S. Hishinuma et al., "Fabrication of Condenser Microphones on Silicon on Insulator Wafer", Advanced Materials Research, Vols. 306-307, pp. 193-200, 2011

Online since:

August 2011

Export:

Price:

$35.00

[1] T. Tajima, T. Nishiguchi, S. Chiba, A. Morita, M. Abe and K. Tanioka: Microelec. Engin. Vol. 80 (2003), p.508.

[2] P. R. Scheeper, B. Nordstrand, J. O. Gullv, L. Bin, T. Clausen, L. Midjord and T. Storgaard-Larsen: J. Microelectromech. Sys. Vol. 12 (2003), p.880.

DOI: 10.1109/jmems.2003.820260

[3] A. S. Sezen, S. Sivaramakrishnan, S. Hur, R. Rajamani, W. Robbins and B. J. Nelson: J. Biomech. Eng. Vol. 127 (2005) , p.1030.

[4] R. Dieme, G. Bosman and T. Nishida:J. Acoust. Soc. Am. Vol. 119 (2006) , p.2710.

[5] J. W. Weigold, T. J. Brosnihan, J. Bergeron, and X. Zhang, MEMS2006, Istanbul, Turkey, January pp.22-26, (2006).

[6] C. W. Tan and J. Miao: J. Acoust. Soc. Am. Vol. 120 (2006), p.750.

[7] H. -S. Kwon and K. -C. Lee, 138 (2007), p.81.

[7] J. Liu, D. T. Martin, K. Kadirval, T. Nishida, L. Cattafesta, M. Sheolak and B. P. Mann: J. Sound Vibra. Vol. 309 (2008) , p.276.

[8] T. Tajima, T. Nishiguchi, S. Kondo, N. Saito, S. Chiba, A. Morita, and M. Esashi, Mechanical characteristics of a condenser silicon microphone, in: Institute of Electrical Engineers of Japan, Sensors and Micro machines Society Subcategory Conference, MSS-01-31, p.95–98, (2001).

[9] S. Chiba, A. Morita, F. Ando, K. Shoda, and T. Tajima, Considerations on the sensitivity of silicon microphones, in Proceedings of the Acoustic Society of Japan, 3-P-31, p.533–534, (1999).

In order to see related information, you need to Login.