Thermal Conductivity of the Diamond-Cu Composites with Chromium Addition

Abstract:

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The continuous progress of the electronic industries put forward a new requirement to the electronic components that must have an excellent heat conduction performance. Thus diamond-Cu composite is developed as a high thermal conductivity and low coefficient of thermal expansion material. A vacuum hot pressing method is chosen to prepare diamond-Cu composites and the thermal conductivity of the diamond-Cu composite is researched. The effects of different contents of chromium, the size of diamond particles and the content of diamond particles on the thermal conductivity of the diamond-Cu composite are discussed. The results demonstrate that the chromium element can improve the thermal conductivity of the composites and the thermal conductivity is largest when the content of chromium is 3 percent.

Info:

Periodical:

Advanced Materials Research (Volumes 311-313)

Edited by:

Zhongning Guo

Pages:

287-292

DOI:

10.4028/www.scientific.net/AMR.311-313.287

Citation:

Q. Zuo et al., "Thermal Conductivity of the Diamond-Cu Composites with Chromium Addition", Advanced Materials Research, Vols. 311-313, pp. 287-292, 2011

Online since:

August 2011

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Price:

$35.00

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