Collar TEOS Integrity of Deep Trench DRAM Capacitor with a Vertical Parasitic NMOSFET


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An adequate measurement metrology to nondestructively verify the integrity of dielectric gap-fill in a deep trench (DT) capacitor of deep-submicron DRAM product was proposed. Because of the geometric structure in the DT capacitor, the vertical cylindrical electrode isolator approximately provides a parasitic NMOSFET. Through the electrical measurement, people can analyze these drain-to-source electrical characteristics. Some of most valuable device parameters, threshold voltage (Vt) and mobility (un), correlate to the interface integrity and the surface roughness between silicon substrate and gap-fill oxide (or liner oxide). In other words, as these values are obtained, the degradation level of this interface or gap-fill quality can be clarified. Indirectly, the charge storage quality of this capacitor, avoiding the leakage path, is able to be improved with the process modification.



Advanced Materials Research (Volumes 314-316)

Edited by:

Jian Gao






M. C. Wang and H. C. Yang, "Collar TEOS Integrity of Deep Trench DRAM Capacitor with a Vertical Parasitic NMOSFET", Advanced Materials Research, Vols. 314-316, pp. 2385-2388, 2011

Online since:

August 2011




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