On the Reliability of Nanoindentation on Si Wafer at Elevated Temperatures

Abstract:

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The papers has been removed as the papers has been commercially missused and is in fact being exploited in the commercial arena.

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Periodical:

Edited by:

Taghi Tawakoli

Pages:

684-689

DOI:

10.4028/www.scientific.net/AMR.325.684

Online since:

August 2011

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$35.00

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