PCB Related Failures in Electronic Assemblies

Abstract:

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The complexity of Printed Circuit Boards (PCBs) has increased dramatically over the last three decades with the development of surface mount technology (SMT). The typical manufacture of rigid multilayer PCB contains many process procedures, which makes manufacture and application much more challenges. This paper focuses on some typical PCB related failures. Recommendations are provided on optimizing PCB manufacture process and material application. Microvia crack, black pad, galvanic attack, pad design, conductive anodic filament and pad crater are presented in detail.

Info:

Periodical:

Advanced Materials Research (Volumes 341-342)

Edited by:

Liu Guiping

Pages:

411-415

DOI:

10.4028/www.scientific.net/AMR.341-342.411

Citation:

P. Liu et al., "PCB Related Failures in Electronic Assemblies", Advanced Materials Research, Vols. 341-342, pp. 411-415, 2012

Online since:

September 2011

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Price:

$35.00

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