Research on Surface Coating Technology of PCB Based on ENEPIG


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Now the protection method for PCB welding board, widely used coating technology is ENIG , but in use course found that the coating will appear “black mat” that is fatal flaw in the welding process, in order to solve this problem, the engineers and technicians have taken various methods of strict control parameter, despite the improvement, but has not eradicated “black mat” this hidden trouble .Electroless palladium layer is introduced in ENEPIG surface coating new technology, from the reaction mechanism stopped nickel-plate oxidation, in the process of immersion gold blocked off nickel-plate contacted with Immersion gold solution, and effectively prevent pervasion and migration of nickel , thus effectively inhibit oxidation of nickel surface, prevent the “black mat” flaw . Not only have given the technology production process and parameter control, but also have microcosmic appearance and diffusibility analysis for the products by using SEM and EDS , the results showed that palladium layer is non-crystalline film with good uniformity of coating thickness, and did not find pervasion of nickel on gold surface, successfully achieve ENEPIG PCB mass production, replace ENIG technology .



Advanced Materials Research (Volumes 418-420)

Edited by:

Xianghua Liu, Zhengyi Jiang and Jingtao Han




J. W. Yu "Research on Surface Coating Technology of PCB Based on ENEPIG", Advanced Materials Research, Vols. 418-420, pp. 851-855, 2012

Online since:

December 2011





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