The Microstructure and Electrical Property of Porous Cu Film on Soft PVDF Substrate


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The porous Cu film was deposited on soft PVDF substrate by magnetron sputtering at different sputtering pressure. The microstructure and electrical properties of Cu films were investigated as a function of sputtering pressure by X-ray diffraction XRD and Hall effect method. The results show that the surface morphology of Cu film is porous, and the XRD revealed that there are Cu diffraction peaks with highly textured having a Cu-(220) or a mixture of Cu-(111) and Cu-(220) at sputtering pressure 0.5 Pa. The electrical properties are also severely influenced by sputtering pressure, the resistivity of the porous Cu film is much larger than that fabricated on Si substrate. Furthermore, the resistivity increases simultaneously with the increasing of Cu film surface aperture, but the resistivity of Cu film still decreases with the increasing grain size. It can be concluded that the crystal structure is still the most important factor for the porous Cu film resistivity.



Advanced Materials Research (Volumes 472-475)

Edited by:

Wenzhe Chen, Xipeng Xu, Pinqiang Dai, Yonglu Chen and Zhengyi Jiang




X. H. Wang et al., "The Microstructure and Electrical Property of Porous Cu Film on Soft PVDF Substrate", Advanced Materials Research, Vols. 472-475, pp. 1451-1454, 2012

Online since:

February 2012




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