Thermal Design and Thermal Analysis of an Enclosure in Harsh Environment Conditions

Abstract:

Article Preview

The appropriate temperature is a critical factor for an enclosure with a stability guarantee. Therefore, in the prerequisite of vibration and Electro Magnetic Compatibility (EMC) being satisfied, how to make effective thermal design is what the research staff are generally concerned about. Firstly, a comprehensive description of the overall structure for a sealed enclosure is provided. Then the cooling plate is designed by using the method of theoretical calculation. At the same time, the temperature of the enclosure is analyzed by using Flow Simulation; the distribution of temperature field for the enclosure is obtained. Both classical heat transfer theory and a computational approach are used to verify the enclosure cooling performance. It turns out that applying the method of combining the theoretical calculation and simulation analysis cannot only improve the reliability of thermal analysis, but can also provide some valuable references to the research staff.

Info:

Periodical:

Advanced Materials Research (Volumes 538-541)

Edited by:

Liancheng Zhao, Haowei Wang and Changfa Xiao

Pages:

2043-2046

Citation:

K. Li et al., "Thermal Design and Thermal Analysis of an Enclosure in Harsh Environment Conditions", Advanced Materials Research, Vols. 538-541, pp. 2043-2046, 2012

Online since:

June 2012

Export:

Price:

$41.00

[1] Seri Lee, Malcolm Early and Mark Pellilo: Microelectronics Journal vol. 28 (1997).

[2] Sylvana Varela, Gabriel Usera, Anton Vernet and Josep A. Ferrè: International Journal of Thermal Sciences (2011), pp.1-9.

[3] B. Landgraf, A. Krämer-Flecken, J.G. Krom: Fusion Engineering and Design vol. 85 (2010), pp.332-334.

[4] Yiqi Fang, Lingling Sun: Machinery Design & Manufacture vol. 12 (2010), pp.23-25, In Chinese.

[5] J.C. King, M.S. El-Genk: Nuclear Engineering and Design vol. 239 (2009), pp.2809-281.

[6] Y.Y. Wang*, C. Lu, J. Li, X.M. Tan, Y.C. Tse: Finite Elements in Analysis and Design vol. 41 (2005), pp.667-680.