Preparation and Properties of Silicon-Containing Arylacetylene Resins with Octa(maleimidophenyl)silsesquioxane


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Modified silicon-containing arylacetylene resins (DMSEPE-OMPS) were prepared from poly(dimethylsilyleneethynylenephenyleneethynylene) (DMSEPE) and Octa(maleimidophenyl)- silsesquioxane (OMPS). The curing reaction of DMSEPE-OMPS resin was studied by FT-IR and DSC techniques. Thermal stability and dielectric properties of cured DMSEPE-OMPS resins were determined. FT-IR and DSC analyses indicate that thermal polymerization of DMSEPE-OMPS resin occurs in the curing process. Thermal stabilities of cured DMSEPE-OMPS resins under N2 and air atmosphere decrease gradually with the increment of OMPS components. The incorporation of OMPS can obviously reduce dielectric constant of DMSEPE-OMPS resins.



Advanced Materials Research (Volumes 557-559)

Edited by:

Hongbing Ji, Yixin Chen and Shengzhou Chen




Y. Zhou et al., "Preparation and Properties of Silicon-Containing Arylacetylene Resins with Octa(maleimidophenyl)silsesquioxane", Advanced Materials Research, Vols. 557-559, pp. 1152-1156, 2012

Online since:

July 2012




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