Advances in Abrasive Technology XV

Volume 565

doi: 10.4028/

Paper Title Page

Authors: X.L. Zhu, Z.G. Dong, Ren Ke Kang, D.M. Guo

Abstract: This study presents design of an ultra-precision wafer grinder which incorporates state-of-the-art automatic supervision and control system....

Authors: Bin Shen, Liang Wang, Su Lin Chen, Fang Hong Sun

Abstract: The CVD diamond/diamond-like carbon composite film is fabricated on the WC-Co substrate by depositing a layer of Diamond-like Carbon film on...

Authors: Peng Yao, Chuan Zhen Huang, Jun Wang, Tunemoto Kuriyagawa

Abstract: A rough ground fused silica surface can be ground in a ductile mode by ultra-precision grinding after repairing the surface and subsurface...

Authors: Ben Wang, Hang Gao, Song Peng Zhang, Yong Jie Bao

Abstract: The main source of heat generation during machining of carbon/epoxy composites is the friction among cutting tool, chip and workpiece. The...

Authors: Qi Lin Li, Jiu Hua Xu, Hong Hua Su, Yu Can Fu

Abstract: Localized ultra-high frequency induction brazing is proposed to deal with the thermal deformation problem of brazed diamond tools. In order...

Authors: Ping Yan Bian, Bo Zhao, Zhe Liu

Abstract: Based on similarity principle, cutting modes of turning, milling, grinding etc are equivalent to three load forms of dot, line and face. And...

Authors: Wan Shan Wang, Peng Guan, Tian Biao Yu

Abstract: The deformation of the spindle system is the main factor affecting the accuracy of ultra-high speed grinding. To calculate the deformation...

Authors: Qi Zhang, Zheng Yi Jiang, Guo Liang Xie, Dong Bin Wei, Jing Tao Han

Abstract: A cast iron/low carbon steel sandwich-structured bimetal fabricated through composite casting, followed by hot rolling and hot compression...

Authors: Hirotaka Ojima, Kazutaka Nonomura, Li Bo Zhou, Jun Shimizu, Teppei Onuki

Abstract: The underlying data form of a wafer is a matrix of length (or height) measurements. In the presence of noise, evaluation parameters are...

Authors: Yun Huang, Yong Sheng Chen, Wei Wan, Cao Yong Tang, Ming De Zhang

Abstract: This paper introduces an automatic ultrasonic wall thickness measurement system, which adopts the way that the tube billet is partially...


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