Quality Monitoring and Prospects of Wire Bonding

Abstract:

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Wire bonding is rapidly developmental technology of microelectronic packaging nearly half a century and become the main trend of semiconductor packaging field currently. This article introduces the main process parameters influencing on bonding quality, the methods to improve the bonding reliability, and prospects of developmental tendency of wire bonding.

Info:

Periodical:

Advanced Materials Research (Volumes 588-589)

Edited by:

Lawrence Lim

Pages:

1156-1160

Citation:

G. G. Mei et al., "Quality Monitoring and Prospects of Wire Bonding", Advanced Materials Research, Vols. 588-589, pp. 1156-1160, 2012

Online since:

November 2012

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Price:

$38.00

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