Quality Monitoring and Prospects of Wire Bonding
Wire bonding is rapidly developmental technology of microelectronic packaging nearly half a century and become the main trend of semiconductor packaging field currently. This article introduces the main process parameters influencing on bonding quality, the methods to improve the bonding reliability, and prospects of developmental tendency of wire bonding.
G. G. Mei et al., "Quality Monitoring and Prospects of Wire Bonding", Advanced Materials Research, Vols. 588-589, pp. 1156-1160, 2012