Influence of Different Deposition Parameters on the Performance of a Ti-Ta-C Interface Layer in SiC-Fiber Reinforced Copper Matrix Composites

Abstract:

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The mechanical properties of a SiC-fiber/copper matrix composite, reinforced with SCS-0 SiC-fibers ( 140µm, Specialty Materials), can significantly be increased by applying a Ti-Ta-C multilayer between fiber and matrix. This interlayer is deposited with a magnetron sputter device directly on the single fibers. By changing the deposition parameters of this sputter process the Ti-Ta-C interlayer can be optimized regarding fiber strength and fiber/matrix adhesion. Experiments with different deposition pressures, bias voltages and layer thickness’ were performed to increase the bond strength and the ultimate tensile strength when compared to the Ti-Ta-C reference sample.

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Periodical:

Edited by:

Ch. Linsmeier and M. Reinelt

Pages:

138-142

DOI:

10.4028/www.scientific.net/AMR.59.138

Citation:

T. Köck et al., "Influence of Different Deposition Parameters on the Performance of a Ti-Ta-C Interface Layer in SiC-Fiber Reinforced Copper Matrix Composites", Advanced Materials Research, Vol. 59, pp. 138-142, 2009

Online since:

December 2008

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$35.00

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