Study on Wafer Thinning Characteristics of Ultimate Diamond Disk


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Silicon wafer is machined by diamond cutting tools to certain extent, the cutting tool currently used is polycrystalline diamond (PCD). However, as its cutting edges are not leveled to the same height, it will produce different depth of cut and the stress distribution is uneven on wafer surfaces, in the process of wafer thinning, both the workpiece and the cutting tool are probably damaged, this will increase the production cost accordingly. In this paper, a strategy is described to improve the ability of cutting tool for wafer thinning, a cutting tool named Ultimate Diamond Disk (UDD) designed by Taiwan Wheel Company is recommended, which can reduce both the crack of workpiece and the wear speed of cutting tool. Moreover, an experiment on base of different machining parameters including rotation speed of spindle, feed rate and depth of cut was tested and discussed. As a result, the removal mode of workpiece material and the wafer thinning characteristics of UDD are obtained.



Advanced Materials Research (Volumes 591-593)

Edited by:

Liangchi Zhang, Chunliang Zhang, Jeng-Haur Horng and Zichen Chen




X. X. Jin, "Study on Wafer Thinning Characteristics of Ultimate Diamond Disk", Advanced Materials Research, Vols. 591-593, pp. 476-479, 2012

Online since:

November 2012





[1] Li Jian-ping, Study on Wheel Grinding Characteristics of Wafer Surface Contour" , Tsinghua University master, s thesis, July (2009).

[2] T.C. Lung and S. C Zu and W. Zuang and C. S Zhou and C. C Zhou and Y. L Tai, The Design Features of UDD, KINIK Company, Taiwan.

[3] L.B. Zai and X.P. Zi and M. Yahman , Study on the mechanism of nanoscale ductile mode cutting of silicon using molecular dynamics simulation, International Journal of Machine Tools & Manufacture 47 , pp.75-80, (2008).