Design and Simulation of Visual Miniature Loop Heat Pipe

Chen, Yan; Qu, Yan; Zhang, Shu Sheng

doi:10.4028/www.scientific.net/AMR.605-607.346

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HomeAdvanced Materials ResearchAdvanced Designs and Researches for ManufacturingDesign and Simulation of Visual Miniature Loop...

Design and Simulation of Visual Miniature Loop Heat Pipe

Abstract:

A miniature loop heat pipe (MLHP) with a glass condenser was designed and manufactured. Stress analysis on compensation chamber/evaporator and glass condenser is made to confirm strength of loop heat pipe using the software MSC NASTRAN. Results indicate this new structure loop heat pipe can meet the design requirements and secure to work well. A system level performance analysis was made about heat transfer and fluid flow characteristics inside loop heat pipe using the software of SINDA/FLUINT. This miniature loop heat pipe realized visualization research of phase change phenomenon to some extent.

Info:

Periodical:

Advanced Materials Research (Volumes 605-607)

Main Theme:

Advanced Designs and Researches for Manufacturing

Edited by:

Pengcheng Wang, Xiangdong Liu and Yongquan Han

Pages:

346-351

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.605-607.346

Citation:

Y. Chen et al., "Design and Simulation of Visual Miniature Loop Heat Pipe", Advanced Materials Research, Vols. 605-607, pp. 346-351, 2013

Online since:

December 2012

Authors:

Yan Chen, Yan Qu, Shu Sheng Zhang

Keywords:

Heat Transfer, Miniature Loop Heat Pipe, Stress Analysis, Visualization

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Price:

$41.00

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References

[1] Jon Zuo, Chanwoo Park et al, Hybrid Loop Cooling of High Heat Flux Components, AIAA paper.

DOI: https://doi.org/10.2514/6.2004-5612

[2] David Bugby et al, Multi-Evaporator Hybrid Loop Heat Pipe for Small Spacecraft Thermal Management, IEEEAC paper1519, Version 3, 2004. 12.

[3] Mohammed Hamdan, Debra Cytrynowicz et al, Loop Heat Pipe(LHP)Development by Utilizing Coherent Porous Silicon (CPS) wicks, IEEE Inter Society Conference on Thermal Phenomena, (2002).

DOI: https://doi.org/10.1109/itherm.2002.1012492

[4] Chin-Chun Hsu, Shung-Wen Kang et. al, Performance Testing of Micro Loop Heat Pipes, Tamkang Journal of Science and Engineering, Vol. 8, No 2, pp.123-132, (2005).

[5] Debra G. Cytrynowicz, Contributions to the initial development of a micro electromechanical loop heat pipe, which is based on coherent porous silicon, Ph. D dissertation, University of Toledo, 2004. 12.

[6] Yu. F. Maidanik, S.V. Vershinin et al, Development and Tests of Miniature Loop Heat Pipe with a Flat Evaporator, SAE paper 2000-01-2491.

DOI: https://doi.org/10.4271/2000-01-2491

[7] Yu.F. Maidanik, Review-Loop Heat Pipe, Applied Thermal Engineeing, 2004. 9.

[8] Amir Faghri, Heat Pipe Science and Technology, Taylor& Fancis, (1995).

[9] Ding Bomin, Analysis of American Pressure Vessel Code—ASME VIII-1 and VIII-2[M], East China University of Technology Publishing house, (1995).

[10] G.E. Cossali, M. Marengo and S. Zinna, Response of a loop heat pipe subjected to various heat load transient, XXIV UIT National Heat Transfer Conference, Parma, June (2005).

[11] Incropera, P. F., Dewitt, D. P., Fundamental of heat and mass transfer. Fifth Ed., John Wiley & Sons.

Paper TitlePages

Investigation on the Heat Exchange Characteristics of the Condenser for Space Applications

Authors: Jie Liu, En Ze Zhou, Wen Jun Zhao, Shuang Shuang Li

Abstract: In this paper, the characteristics of a special condenser for space thermal control were investigated. In order to compare the thermoresistance getting from different formulas, both single-phase and two-phase fluid in the condensers were calculated. The results present that the thermoresistance has a uniform value for single-phase and a large variance for two-phase fluid. Therefore, experiences were performed to clearly comprehend two-phase fluid performance in the condenser. From the experiments, it demonstrates that the condenser thermoresistance has decreased with the heat load increasing under the same mass flow rate. The analyzes points out that the thermoresistance caused by contact plays a more importance role for the condenser heat rejection capacity.

249

Steady Sate Modeling of LHP and Analysis

Authors: Yan Chen, Wei Chang, Shu Sheng Zhang, Chun Sheng Guo

Abstract: An ammonia-stainless steel steady state modeling of loop heat pipe was established, the impacts on the LHP operating temperature induced by alterable heat loads under 3 operating cases (the different position between evaporator and condenser, the changing of ambient temperature and the changing of heat sink temperature) were analyzed and conclusions were made. Changing the position between evaporator and condenser has a significant influence on the LHP operating temperature. Anti-gravity operation will reduce the performance of the LHP, this phenomenon is obviously in low heat load range. Further more, increasing of fluid pressure drop in the loop will induce decreasing of the LHP performance. The temperature difference between ambient and heat sink will influence the transition heat load (from variable conductance mode to fixed conductance mode), the bigger the temperature difference the higher the transition heat load.

1834

Simulation of Heat Flux Effect in Straight Heat Pipe as Passive Residual Heat Removal System in Light Water Reactor Using RELAP5 Mod 3.2

Authors: M. Hadi Kusuma, Nandy Putra, Surip Widodo, Anhar Riza Antariksawan

Abstract: Heat pipe is considered being used as a passive system to remove residual heat that generated from reactor core when incident occur or from spent fuel pool. The present research is aimed to studying the characteristics of straight heat pipe as passive residual heat removal system. As an initial step, a numerical simulation was conducted to simulate the best experimental design set up being prepared for the next step of the research. The objective is to get the thermal hydraulic characteristic due to variation of heat flux of heat source. The thermal hydraulic RELAP5 MOD 3.2 code is used to simulate and analyze the straight heat pipe characteristics. Variations of heat flux are 1567 Watt/m², 3134 Watt/m², 4701 Watt/m², 6269 Watt/m², and 7837 Watt/m². Water as working fluid is heated on evaporation section with filling ratio 60%. Environmental air with variation 5 m/s and 10 m/s of velocity are used as external cooler. Straight heat pipe used in the simulation is wickless with 0.1 m of diameter and 6 m of length. The results show that higher heat flux given to the evaporator section will lead to more rapid heat transfer and achievement of steady state condition. The increasing of heat flux leads to an increase of evaporation of the working fluid and of pressure built in the heat pipe affecting higher saturation temperature of working fluid. Heat flux loading must consider the velocity of air as heat removal in the condenser to prevent dry out phenomenon in the evaporator. Based on the results, given the experimental set-up, the optimum range of experimental parameters could be determined.

122

Research on Thermal Resistance of Micro Heat Pipe with Trapezium-Grooved Wick

Authors: Xi Bing Li, Ming Jian Li, Ming Li, Ying Si Wan

Abstract: As an efficient heat conducting unit, micro heat pipe is widely used in high heat flux microelectronic chips, and thermal resistance is one of the factors that are crucial to its heat transfer capacity. Based on heat transfer theory, this paper established a theoretical model of total thermal resistance through analyzing the structure and heat transfer performance of circular heat pipe with trapezium-grooved wick, simplified the model and tested the micro heat pipe for its total thermal resistance performance by setting up a testing platform. The testing results show that when the micro heat pipe is in the optimal heat transfer state, its total thermal resistance well coincides with that from the established theoretical model. As for a micro heat pipe with trapezium-grooved wick, its total thermal resistance first decreases, then increases with heat transfer capability increment, and reaches the minimum when it is in the optimal state of heat transfer performance. That too much working fluid accumulates in evaporation section and the vapor velocity is rather low is the main cause for the greater thermal resistance when the pipe is in low heat transfer quantity, yet the greater total thermal resistance when the pipe is in high heat transfer quantity is mainly caused by the working fluid drying up in condensation section. The total thermal resistance is related to many factors, such as the thermal conductivity of tube-shell material, wall thickness, wick thickness, the number of the grooves, the lengths of condensation and evaporation sections, the diameter of vapor cavity etc.. Therefore, the structure parameters of a micro heat pipe with trapezium-grooved wick should be rationally designed according to specific conditions to ensure its heat transfer capacity and total thermal resistance to meet the requirements and be in the optimal state.

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