Design Key Points for High Power LED Encapsulation


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LED performance was significantly improved because of the improvement of encapsulation design and materials properties. The design key points were reviewed in point view of optical, electrical, thermal, and reliability consideration. It was concluded that the packaging design should be simultaneously implemented with the chip design, integrally considering the optics, electrics, thermal, and reliability together. The interfacial thermal resistance and stress from packaging also play critical roles for the optical efficiency and reliability of packaged LED device.



Edited by:

Tan Jin




Z. F. Zhao and J. Ye, "Design Key Points for High Power LED Encapsulation", Advanced Materials Research, Vol. 651, pp. 706-709, 2013

Online since:

January 2013




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