Numerical Simulation of Stretchable and Foldable Silicon Integrated Circuits


Article Preview

This paper presents numerical simulation strategies for stretchable silicon integrated circuits that use stiff thin film on elastomeric substrates. Detailed numerical simulation studies reveal the key underlying aspects of these systems. The results indicate, as an example, optimized mechanics and materials for circuits that exhibit maximum principal strains less than 0.2% even for applied strains of up to ~90%. Simple circuits, including CMOS inverters provide an example that validates these designs. The results suggest practical routes to high performance electronics with linear elastic responses to large strain deformations, suitable for diverse applications that are not readily addressed with conventional wafer-based technologies.



Edited by:

Selin Teo, A. Q. Liu, H. Li and B. Tarik




Z. J. Liu et al., "Numerical Simulation of Stretchable and Foldable Silicon Integrated Circuits", Advanced Materials Research, Vol. 74, pp. 197-200, 2009

Online since:

June 2009




Fetching data from Crossref.
This may take some time to load.