NEMS/MEMS Technology and Devices - ICMAT2009, ICMAT2009

Volume 74

doi: 10.4028/

Paper Title Page

Authors: H. Liu, N. Zhang, Zi Chao Shiah, X. Zhou

Abstract: This paper reports the fabrication, testing and characterization of an optofluidic sensor for biological sample detection at nanoscale. This...

Authors: Shao Li Zhu, Jing Bo Zhang, Lanry Yung Lin Yue, Dany Hartono, Ai Qun Liu

Abstract: Protein plays key role in cellular processes and diseases diagnosis [1-3]. This paper reports a label-free detection of proteins through...

Authors: George C.K. Chen, Srivathsan Vasudevan, Teu Choon Kiat

Abstract: Photothermal technology can be applied for thermal characterization of thin films and studying biological live cells. Using pulsed...

Authors: Chiang Ho Cheng, Chia Lan Chang, Tsung Hsing Chan

Abstract: The present research applies the microelectronmechanical system (MEMS) technology to design and fabricate a novel micro-bubble generator by...

Authors: Wee Yang Ng, Yee Cheong Lam, Isabel Rodríguez

Abstract: This paper presents an experimental investigation on the DC-biased AC-electrokinetic (ACEK) flow vortex in a rectangular microchannel. This...

Authors: Lung Jieh Yang

Abstract: This paper proposes a new way to detect the gas-leakage through PDMS. We use PDMS instead of Pyrex #7740 glass to seal the backside...

Authors: Jing Bo Zhang, L. Cheng, L.Y.L. Yung, S.S. Chua, J.Y. Sze, Shao Li Zhu, T.C. Ayi, R. Jeevaneswaran

Abstract: This paper elaborates on approaches of synthesis of Au and Ag nanoparticles (NPs), deposition of colloid onto glass substrate and...

Authors: Rong Mo Luo, Hua Li, Teng Yong Ng

Abstract: A multiphysics model is presented to simulate the ionic transport interaction between the smart pH-electric-sensitive hydrogel and solution...

Authors: Harry J. Whitlow, Li Ping Wang, Leona Gilbert

Abstract: Proton beam writing (PBW) is a MeV ion beam lithography technique that has gained interest in many biological applications such as...

Authors: Ang Xiao Fang, Jun Wei, Chen Zhong, Wong Chee Cheong

Abstract: Typically, copper material is used as a bonding material in MEMs devices for its excellent mechanical, electrical and hermetic properties....


Showing 21 to 30 of 78 Paper Titles