Epoxy Curing System with Liquid 1,3-Bis(3-aminopropyl) tetramethyl Disiloxane as Curing Agent for Advanced Electronic Package

Abstract:

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, 1,3-bis(3-aminopropyl) tetramethyl disiloxane (DS) is used as liquid epoxy curing agent of epoxy molding compounds(EMCs) for high-reliability semiconductor devices. Experimental results indicated that DS could be effectively used as epoxy curing agent and greatly lower the viscosity of epoxy system, in which way, the coefficient of thermal expasion(CTE) of EMCs can be lowered effectively by increasing the filler loading. The concentration of DS strongly affected the mechanical properties of the thermally cured epoxy composites. As expected, the flexural modulus of epoxy composite decreased and the toughness was improved.

Info:

Periodical:

Advanced Materials Research (Volumes 79-82)

Edited by:

Yansheng Yin and Xin Wang

Pages:

2135-2138

DOI:

10.4028/www.scientific.net/AMR.79-82.2135

Citation:

H. Y. Li and C. H. Xie, "Epoxy Curing System with Liquid 1,3-Bis(3-aminopropyl) tetramethyl Disiloxane as Curing Agent for Advanced Electronic Package", Advanced Materials Research, Vols. 79-82, pp. 2135-2138, 2009

Online since:

August 2009

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Price:

$35.00

[1] H. Lee, K. Neville: Handbook of epoxy resins. ( New York, McGraw-hill 1967).

[2] R.J. Young, P.W.R. Beaumont: J Mater Sci Vol 12(1977), p.684.

[3] A.C. Moloney, H.H. Kausch, H.R. Stieger: J Mater Sci Vol. 18 (1983), p.208.

[4] A.C. Moloney, H.H. Kausch, T. Kaiser, H.R. Beer: J Mater Sci Vol. 22 (1987), p.381.

[5] D.R. Halk: Surface Mount Tech. Vol. 54. (1997).

[6] Y. Tsukada, Y. Mashimoto, T. Nishio and N. Mii, in: Materials and Processes, Reliability, Quality Control and NDE, edited by W.T. Chen and Hiroyuki Abe, American Society of Mechanical Engineers, New York (1992), p.827.

[7] S.C. Machuga, S.E. Lindsey, K.D. Moore, A.F. Skipor, in: Proc. IEEE/CHMT Intl. Electron. Manufact. Technol. Symp., 1992, p.53.

[8] R. Ghoshal, M. Sambasivam, P.K. Mukerji, Microelec. Int. Vol. 14(3) (1997), p.12.

[9] J. Spanoudakis, R.J. Young: J Mater Sci Vol. 19 (1984) p.473.

[10] Emel Yigör and İskender Yilgör: Polymer Vol. 39 (1998), p.1691.

[11] S.H. Sheng, P.C. Yen, K.C. Cheng, L.K. Ping: Polymer Vol. 41 (2000), p.3263.

[12] M. Ochia, K. Takemiyaa, O. Kiyoharab, T. Nakanishi: Polymer Vol. 41 (2000), p.195.

[13] H.H. Tsung, C. S. Wang: European Polymer Journal Vol. 37 (2001), p.267.

[14] A.A. Kumar, M. Alagar, R.M.V.G.K. Rao: Polymer Vol. 43(2002), p.693.

[15] C. Kaynak, C. Celikbilek , G. Akovali: European Polymer Journal Vol. 39 (2003), p.1125.

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