Transient Liquid Phase Bonding of Alumina to Alumina via Bismuth Oxide Interlayer

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Bismuth oxide, due to its low melting point was selected as filler for joining alumina to alumina using Transient Liquid Phase (TLP) method. For this purpose a thin layer of bismuth oxide was placed as an interlayer between the ceramic bodies. To study the effect of time and temperature on the mechanical properties of the joined samples, the joining tests were carried out in 900, 1000 and 1100°C for various times. The mechanical properties of the joined samples were measured using shear testing method. To investigate the microstructure of the joining area, the cross section ofthe joints were studied using scanning electron microscope (SEM) and X-ray diffraction method. The results showed that longer joining times results in higher mechanical properties of the joints. The highest joint strength of about 80 MPa was obtained for the sample joined in 900°C for 10hour.

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Edited by:

M.H. Parsa

Pages:

136-140

Citation:

O. B. Dehkordi and A. M. Hadian, "Transient Liquid Phase Bonding of Alumina to Alumina via Bismuth Oxide Interlayer", Advanced Materials Research, Vol. 829, pp. 136-140, 2014

Online since:

November 2013

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$38.00

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