The Correlation between the Liquid Structure and the Viscosity of Sn-Cu Lead-Free Solders
The liquid structure of two lead-free solder Molten alloys, Sn-0.5Cu and Sn-1.8Cu (wt.%), has been examined using X-ray diffraction method. The main peak for liquid structure of Sn-0.5Cu is similar to that of pure Sn. A pre-peak has been found in the low Q part on the structure factor S(Q) of Sn-1.8Cu tested under 320°C, but it disappeared finally when the testing temperature reached 350°C. The both viscosity was measured using a torsional oscillation viscometer. It was found that the anomalous variations of viscosity had a direct relation with the transition of the liquid structure, which is consonant with the results of high temperature X-ray diffraction. The microstructure of the solder matrixes as well as interfacial reaction between liquid solders and Cu substrates was also studied. The results show that particle-like Cu6Sn5 intermetallic compounds (IMCs) emerge in Sn-1.8Cu solder matrix. The IMC layer at Sn-1.8Cu/Cu joint is thicker than that at Sn-0.5Cu/Cu interface. The correlative effect of liquid structure on phase evolution in the solder joints is analyzed.
Zhengyi Jiang and Chunliang Zhang
X. M. Pan et al., "The Correlation between the Liquid Structure and the Viscosity of Sn-Cu Lead-Free Solders", Advanced Materials Research, Vols. 97-101, pp. 679-682, 2010