Manufacturing Science and Engineering I

Volumes 97-101

doi: 10.4028/www.scientific.net/AMR.97-101

Paper Title Page

Authors: Yan Cong Li, Lian Hong Zhang, Chun Zhang

Abstract: Workpiece’s precision is an important indicator of hydraulic press. In order to accurately predict the accuracy of the part, a method that...

2598
Authors: Jian Hua Rao, Q.F. Shen, C. Wang

Abstract: To improve the working performance of the compound rings high-pressure vessel, the different assembly and structural parameters during the...

2603
Authors: Li Yan, Tao Yi, Liu Jun

Abstract: The machining coordinate system of helical bevel gear machine tool is established through analyzing the machining mechanism of helical bevel...

2607
Authors: Cheng Li, Ying Tie, Yan Ping Zheng

Abstract: Mapping functions of various ellipses are gained by complex function theory. Applying stress function with complex variables, a mechanical...

2614
Authors: Tie Geng, Jia Min Zhang, Rong Ren Wu, Yan Shan

Abstract: The structure and process of the injection mould for the front-bumper of a car were optimized with the domestic 3D flowing simulation...

2618
Authors: Hong Guang Jiao, Peng Liu, Zhan Xu Tie

Abstract: To solve the conflict between separation space and magnetic field intensity, an original magnetic circuit structure system of permanent...

2622
Authors: Gui Xia Zheng, Yi Jian Huang, Ben Gan

Abstract: Vibrating screens are subject to high levels of acceleration and often impart significant dynamic loads on plant buildings, especially in...

2628
Authors: Wei Min Wang, Yan Jun Lu, Zhi Jun Cao, Yong Fang Zhang, Lie Yu

Abstract: The unbalanced response and corresponding bifurcation behavior of the rotor dynamic system supported by gas journal bearings are...

2634
Authors: Yong Ding, Jang Kyo Kim, Rong Yue Zheng

Abstract: The microscopic mechanism of ultrasonic wire bonding is investigated by molecular dynamics simulation on the interfacial contact and...

2639
Authors: Zhan Hui Li, Yun Xin Wu, Zhi Li Long

Abstract: Thermosonic bond is widely used in package of semiconductor chip due to its advantages, such as simple process, high efficiency, and no...

2644

Showing 571 to 580 of 980 Paper Titles