A Fundamental Investigation on Ultrasonic Assisted Fixed Abrasive CMP (UF-CMP) of Silicon Wafer


Article Preview

Chemical mechanical polishing (CMP) is often employed to obtain a super smooth work-surface of a silicon wafer. However, as a conventional CMP is a loose abrasive process, it is hard to achieve the high profile accuracy and lots of slurry must be supplied during CMP operations. As an alternate solution, a fixed abrasive CMP process can offer better geometrical accuracy and discharges less waste disposal. In this paper, in order to enhance the polishing efficiency and improve the work-surface quality, a novel ultrasonic assisted fixed abrasive CMP (UF-CMP) is proposed and the fundamental machining characteristics of the UF-CMP of a silicon wafer is investigated experimentally. The results show that with the ultrasonic assistance, the material removal rate (MRR) is increased, and the surface quality is improved.



Edited by:

Taufiq Yap Yun Hin




Y. B. Wu and L. J. Wang, "A Fundamental Investigation on Ultrasonic Assisted Fixed Abrasive CMP (UF-CMP) of Silicon Wafer", Advanced Materials Research, Vol. 983, pp. 208-213, 2014

Online since:

June 2014




* - Corresponding Author

[1] TÖenshoff HK, et al. Abrasive Machining of Silicon [J]. Annals of the CIRP, 39, 2 (1990) 621–635.

[2] L. Zhou, et al. Development of Chemo Mechanical Grinding (CMG) Process, Proc of Int' Conf. on LEM21, (2003) 315-320.

[3] L. Zhou, et al. Defect-free Fabrication for Single Crystal Silicon Substrate by Chemo-Mechanical Grinding, Annals of the CIRP - Manufacturing Technology; 15 (2006) 313-316.

DOI: https://doi.org/10.1016/s0007-8506(07)60424-7

[4] L. Zhou, et al. Research on Chemo-Mechanical Grinding of Large Size Quartz Glass Substrate [J]. Precision Engineering, 33 (2009) 499-504.

DOI: https://doi.org/10.1016/j.precisioneng.2009.01.006

[5] Y. Wu, et al. Performance improvement of chemo-mechanical grinding in single crystal silicon machining by the assistance of elliptical ultrasonic vibration [J]. Int. J. of Abrasive Tech., 4, 2 (2011) 117-131.

DOI: https://doi.org/10.1504/ijat.2011.041607

[6] S. Shimada, et al. Suppression of Tool Wear in Diamond Turning of Copper under Reduced Oxygen Atmosphere [J]. Annals of CIRP, 49, 1 (2000) 21-24.

DOI: https://doi.org/10.1016/s0007-8506(07)62888-1

Fetching data from Crossref.
This may take some time to load.