A Fundamental Investigation on Ultrasonic Assisted Fixed Abrasive CMP (UF-CMP) of Silicon Wafer
Chemical mechanical polishing (CMP) is often employed to obtain a super smooth work-surface of a silicon wafer. However, as a conventional CMP is a loose abrasive process, it is hard to achieve the high profile accuracy and lots of slurry must be supplied during CMP operations. As an alternate solution, a fixed abrasive CMP process can offer better geometrical accuracy and discharges less waste disposal. In this paper, in order to enhance the polishing efficiency and improve the work-surface quality, a novel ultrasonic assisted fixed abrasive CMP (UF-CMP) is proposed and the fundamental machining characteristics of the UF-CMP of a silicon wafer is investigated experimentally. The results show that with the ultrasonic assistance, the material removal rate (MRR) is increased, and the surface quality is improved.
Taufiq Yap Yun Hin
Y. B. Wu and L. J. Wang, "A Fundamental Investigation on Ultrasonic Assisted Fixed Abrasive CMP (UF-CMP) of Silicon Wafer", Advanced Materials Research, Vol. 983, pp. 208-213, 2014