11th International Ceramics Congress

Volume 45

doi: 10.4028/www.scientific.net/AST.45

Paper Title Page

Authors: A. Duckham, J. Levin, T.P. Weihs

Abstract: This paper reviews a new, low-temperature process for soldering and brazing ceramics to metals that is based on the use of reactive...

Authors: Mathieu Brochu, Fabian Edelmann, Robin Valin, Robin A.L. Drew

Abstract: Transient Liquid Phase Bonding (TLPB) is a joining process that uses liquid as medium for the establishment of an interface between two...

Authors: Hiroki Yokoyama

Abstract: Aluminum nitride (AlN) is widely used in the field of electronics because it has high thermal conductivity, good electric and mechanical...

Authors: Koichi Sakaguchi, Shinjiro Domi, Katsuaki Suganuma

Abstract: We have developed a novel technique of joining a pair of glass substrates. In the process, molten solder penetrates the gap between the...

Authors: D. Kalinski, M. Chmielewski, A. Krajewski, M. Kozłowski

Abstract: Reactive sintering of liquid Al with solid Ni resulting in the formation of intermetallic compounds was used for joining parts made of...

Authors: M. Chmielewski, D. Kalinski, K Pietrzak

Abstract: The development of technologies for joining ceramics and metals is connected with an introduction of new ceramic materials and new...

Authors: Hidehiro Yoshida, Koji Morita, Byung Nam Kim, Keijiro Hiraga, Takahisa Yamamoto, Yuichi Ikuhara, Taketo Sakuma

Abstract: High temperature creep and superplastic flow in high-purity oxide ceramics such as alumina and tetragonal zirconia polycrystals is very...

Authors: Marek Boniecki, Rafał Jakieła, Zdzislaw Librant, Wladyslaw Wesolowski, Danuta Dabrowska, Agata Karas

Abstract: The superplastic flow in tetragonal zirconia polycrystals stabilised 3mol% Y2O3 (3YTZP) is strongly affected by the dopant cations, which...

Authors: Hideo Awaji, Seong Min Choi

Abstract: Intra-type nanocomposites, in which nanosized second-phase particles are embedded within matrix grains, generate dislocations around the...

Authors: Tomasz Sadowski, Zdzislaw Librant, Marek Boniecki

Abstract: The aim of the paper is theoretical modelling and experimental verification of the nonsymmetric thermal shock crack propagation in compound...


Showing 231 to 240 of 388 Paper Titles