The compositional and structural stability of ultra-thin Co films, which had been grown onto (111)Cu substrates under ultra-high vacuum, were investigated by using low-energy ion scattering techniques. It was found that, even at room temperature, migration of Cu substrate atoms into the Co film occurred via surface diffusion during and after deposition. The resultant film and interface structure therefore depended critically upon the deposition rate and temperature.

A.Rabe, N.Memmel, A.Steltenpohl, T.Fauster: Physical Review Letters, 1994, 73[20], 2728-31