Data were presented which showed that the Al-Ga interdiffusion coefficient for an AlxGa1-xAs-GaAs quantum-well heterostructure or a superlattice was highly dependent upon the crystal encapsulation conditions (table 4). The activation energy for Al-Ga interdiffusion, and thus layer-disordering, was smaller (about 3.5eV) for dielectric encapsulated samples than after capless annealing (about 4.7eV). The interdiffusion coefficient for Si3N4-capped samples was almost an order of magnitude smaller than for the cases of capless or SiO2-capped samples at temperatures of between 800 and 875C. As well as the type of encapsulant, the encapsulation geometry (stripes or capped stripes) was important because of strain effects. These were a major source of anisotropic Al-Ga interdiffusion.

L.J.Guido, N.Holonyak, K.C.Hsieh, R.W.Kaliski, W.E.Plano, R.D.Burnham, R.L.Thornton, J.E.Epler, T.L.Paoli: Journal of Applied Physics, 1987, 61[4], 1372-9

 

 

 

Table 4

Interdiffusivity (Al-Ga) in AlGaAs/GaAs

 

Conditions

Temperature (C)

D (cm2/s)

capless

875

1.1 x 10-17

SiO2 cap

875

9.6 x 10-18

capless

850

2.9 x 10-18

SiO2 cap

850

2.9 x 10-18

SiO2 cap

825

2.8 x 10-18

capless

825

1.0 x 10-18

Si3N4 cap

875

2.2 x 10-18

Si3N4 cap

850

7.8 x 10-19

SiO2 cap

800

7.0 x 10-19

capless

800

4.5 x 10-19

Si3N4 cap

825

3.8 x 10-19

Si3N4 cap

800

2.2 x 10-19