A 2-dimensional simulation of diffusion in solids was developed in order to monitor the behavior of these systems. This method was able to predict the variations in the Cu and C compositions at their interfaces with Si and Fe, respectively. The technique could be applied to irregular shapes, and to substrates with complex geometries. The interface resistance and other discontinuities were treated by introducing the concept of an element of zero thickness.

A.Z.Moshfegh, S.M.Mirbagheri, M.Shirinparvar: Materials and Manufacturing Processes, 1997, 12[1], 95-105