Interlayer interaction and phase formation in thin multi-layer metallization systems (Au/Pd/Ti, Au/Pd/Cr/Ti) on (111)Si were investigated. It was found that the additional layer (Cr) in the metallization system was no barrier to the interdiffusion of Au and Si during annealing at 650K in air. In fact, the Cr film accelerated the diffusion of Au to the support.

J.N.Makogon, S.I.Sidorenko, J.A.Bazarnyi, N.S.Voltovets, T.V.Litvinova, V.L.Tkachenko: Izvestiya Akademii Nauk SSSR - Neorganicheskie Materialy, 1990, 26[12], 2461-6 (Inorganic Materials, 1990, 26[12], 2116-20)