The distribution of implanted Sn was determined by means of secondary ion mass spectrometry. By comparing the distribution before and after high-temperature annealing, the diffusion coefficient was obtained as a function of temperature. It was found that the diffusion coefficients (table 87) exhibited an Arrhenius behavior; with an activation energy for diffusion of 4.91eV. Although the diffusion coefficient was higher than the corresponding value for self-diffusion, the activation energies were similar to those for Si and self-diffusion. It was suggested that the diffusion mechanism for Sn was similar to that for self-diffusion.
P.Kringhøj, R.G.Elliman: Applied Physics Letters, 1994, 65[3], 324-6
Table 87
Diffusivity of Sn in Si
T (C) | D (cm2/s) |
1195 | 7.8 x 10-14 |
1097 | 6.3 x 10-15 |
1045 | 1.2 x 10-15 |
1045 | 1.0 x 10-15 |
998 | 1.9 x 10-16 |
998 | 1.7 x 10-16 |