Reaction-diffusion in this system was investigated by means of electron-probe micro-analysis. Two types of intermetallic compound, Mg2Cu and Cu2Mg, were observed in the diffusion couples at temperatures ranging from 683 to 748K. The former layer grew faster than the latter layer. The growth rate of the Mg2Cu layer obeyed a parabolic law, as a function of annealing time, and the growth was thus deduced to be diffusion-controlled. A Kirkendall marker shift towards the Cu-rich side was observed; thus suggesting that the diffusion of Cu was faster than that of Mg.

K.Nonaka, T.Sakazawa, H.Nakajima: Materials Transactions, 1995, 36[12], 1463-6