The bonding between grooved and smooth wafers was considered from the experimental and theoretical points of view. Intimate contact was obtained between mirror-polished bare surfaces. A regular net of grooves was prepared by photo-masking on wafers which had a wide range of lattice mismatches. Use of the X-ray diffraction topographic technique established that a periodic set of grooves of a given shape and width produced a substantial decrease in the dislocation density over large areas near to the interface. The observed features were confirmed by calculations which were based upon dislocation interaction laws and upon general rules for their movement.

I.V.Grekhov, T.S.Argunova, M.J.Gutkin, L.S.Kostina, T.V.Kudryavtzeva: Materials Science Forum, 1995, 196-201 1853-8