The causes of stress voiding and electromigration in Al-alloys were considered with regard to some simulations of the effect of line geometry upon mechanical stress. The stress voiding and electromigration behaviors of various Al alloys were presented, and the effect of various barrier layers and anti-reflective coatings was studied. The adverse effect of adding Si to Al-alloys was described, together with Auger and transmission electron microscopic measurements.

S.Kordic, R.A.Augur, A.G.Dirks, R.A.M.Wolters: Applied Surface Science, 1995, 91, 197-207