The local temperature of Al metallization was measured directly during electromigration. High-resolution thermography was used to monitor the void dynamics which were produced by a direct current. In the vicinity of the growing area, infra-red radiation pulses that were less than 0.5s wide were observed at the same time as resistance pulses. Their amplitudes corresponded to a temperature increase of more than 200C. This locally exceeded the melting point of the Al metallization. The pulses were attributed to void movement.

S.Kondo, K.Hinode: Applied Physics Letters, 1995, 67[11], 1606-8