Creep deformation mechanisms in Sn, Sn-3.5Ag and Sn-5Sb were studied between ambient temperatures and 473K. Activation energies for creep of 60.3, 60.7 and 44.7kJ/mol were found for Sn, Sn-3.5Ag and Sn-5Sb, respectively. It was suggested that the rate-controlling deformation mechanism was dislocation climb which was controlled by lattice diffusion in pure Sn and in Sn-3.5Ag alloy, and viscous glide which was controlled by pipe-diffusion in Sn-5Sb alloy.

Deformation Mechanisms in Tin and Tin-Based Electronic Solder Alloys. M.D.Mathew, S.Movva, K.L.Murty: Key Engineering Materials, 2000, 171-174, 655-62