Electrodeposits with a [111] orientation were obtained from a sulphate bath at 30C, using cathodic current densities of 900 to 1300A/m2. Dislocations in the electrodeposit were characterized by using transmission electron microscopy. Dislocations in each of the [111] grains could be classified into 2 groups. One group belonged to high density dislocation bundles which radiated from one small area. Another group was located between the bundles. The dislocations in the first group were directed along the [112] directions parallel to the (111) plane and were of edge type. Some 42% of the dislocations in the second group were also parallel to the (111) plane.

Characterization of Dislocations in Copper Electrodeposits. Y.S.Lee, D.N.Lee: Journal of Materials Science, 2000, 35[24], 6161-8