The effects of compositional effects upon electromigration were analyzed in terms of a new dynamic percolation model. The results reproduced several typical aspects of electromigration. It was concluded that the model could be extended so as to incorporate structural and geometric factors.

Investigation of the Role of Compositional Effects on Electromigration Damage of Metallic Interconnects. C.Pennetta, L.Reggiani, G.Trefan, F.Fantini, A.Scorzoni, I.De Munari: Computational Materials Science, 2001, 22[1-2], 13-8