The dynamic properties of a single dislocation in Cu under an applied stress were studied using constant stress and temperature molecular dynamics. The dislocation was found to accelerate to a terminal velocity. The terminal velocity initially increased linearly with stress and finally approaches the shear wave velocity asymptotically. In the linear regime the drag coefficient was determined. The results were comparable with the experimental data at high temperatures and an order of magnitude higher at low temperatures. The dislocation width was found to oscillate periodically, with a period determined by the stacking fault energy and the elastic coefficients.

Dynamic Properties of Screw Dislocations in Cu - a Molecular Dynamics Study. D.Mordehai, Y.Ashkenazy, I.Kelson, G.Makov: Physical Review B, 2003, 67[2], 024112 (9pp)