The electromigration characteristics of eutectic solder were studied by using thin stripe-type test structures. Significant changes in the microstructure were found after electromigration tests in which the temperature and current density were varied from 80 to 100C and from 4.6 x 104 to 8.7 x 104A/cm2. Whereas voids or local thinning were found near to the cathode end, hillocks were mainly observed near to the anode end. It was calculated, from resistance measurements, that the activation energy for electromigration was 0.77eV. The dominant element migrating along the electron flow at 100C was Pb.

Electromigration Behavior of Eutectic SnPb Solder. J.Y.Choi, S.S.Lee, Y.C.Joo: Japanese Journal of Applied Physics - 1, 2002, 41[12], 7487-90