Investigations of the steady-state creep at 773 to 1073K, of polycrystalline Cu which was oriented so as to induce the participation of dislocation glide on non-compact planes, led to the conclusion that non-compact glide did not control the creep rate but instead appeared in the dislocation glide process of creep as a local event. The analysis of a large set of data, obtained by transmission electron microscopy, revealed dislocation segments which were situated on non-compact planes, single screw dislocations and dislocation loops which cross-slipped between 2 non-compact planes. These phenomena were suggested to be signs of non-compact glide.

Traces of Non-Compact Glide in the Dislocation Structure of Copper after Creep at High Temperatures. M.Kvapilová, A.Orlová: Materials Science and Engineering A, 2002, 328[1-2], 277-82