A Monte Carlo investigation was made, based on the embedded atom method potential, of Σ = 5 grain-boundary sliding in Cu at high temperatures. An important aspect of this approach was the use of simulated annealing techniques. Various sliding behaviors were found: including coupling to migration. Previous results had shown that high temperatures, when applied to an Al Σ = 5 grain boundary, increased the rate of migration. However, no temperature-dependence of the interface migration was found here.

Atomic Simulation of Grain-Boundary Sliding and Migration in Copper. P.Ballo, V.Slugeň: Physical Review B, 2002, 65[1], 012107 (3pp)