The effect of stresses, due to lattice misfit in the Cu/Au interface, was studied by performing molecular dynamics simulations. The results showed that the stress could induce stacking faults to relieve the stress.

Stress-Induced Stacking Faults in the Cu/Au Interface. H.Lei, Y.J.Tang: Journal of Physics - Condensed Matter, 2004, 16[43], 7823-8