Diffusion in vacuum-deposited bilayer thin films was studied at 200 to 500C by using X-ray photo-electron spectroscopy, sheet-resistance measurements and X-ray diffraction analysis. Differences between the present results, and those of previous investigations, were attributed to differences in film microstructure; as controlled by the preparation conditions. The effects of deposition rate, substrate temperature, film thickness and substrate structure upon the diffusion parameters were investigated separately. It was shown that the diffusion activation energy decreased as the deposition rate increased, whereas it increased as the substrate temperature or film thickness increased. Its value for films deposited onto amorphous substrates was less than that for films deposited onto single-crystal substrates.

Effect of Preparation Conditions on the Diffusion Parameters of Cu/Ni Thin Films. N.N.Rammo, M.N.Makadsi, A.M.Abdul-Lettif: Physica Status Solidi A, 2004, 201[14], 3102-8